On this page you can find the dimensions and packing method for Toshiba Semiconductor's SOP-8 package.

Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3.

May 19, 2023 · Hello, On Package_SO, There are several footprints which i think is same. Example : SO-8_3.9x4.9mm_P1.27mm. SOIC-8_3.9x4.9mm_P1.27mm

Package, SOP8. Pin, 8. Dimensions (mm), 3.9x4.9. Thickness (mm), 1.55. Pitch (mm), 1.27. Solder Ball (mm). Plating, Sn. Product Mass (mg), 88.

SOP-8 to DIP-8 SMT Adapter (2.54 mm pitch, 9.5 x 6.62 mm body). [Part Number: IPC0142], $3.49. USD. In Stock. Quantity: 100. Click to enlarge. Lead-Free / RoHS ...

This SOP describes procedures to be followed for calibration and conformity assessment of mass standards for particular classes of documentary standards (e.g.,.

Package, SOP8 JEDEC 150mil(EMP8). Pin, 8. Dimensions (mm), 3.9x5. Thickness (mm), 1.65. Pitch (mm), 1.27. Solder Ball (mm). Plating, Sn2Bi.

Mar 10, 2017 · Hi, I'm having a very hard time using cvpcb. I'm trying to assign a SOP-8 footprint to a component but for the life of me can't find it.