(12) United States Patent ao) Patent No.: us 6,444,499 Bi
Swiss et al. (45) Date of Patent: Sep. 3,2002
(54) METHOD FOR FABRICATING A SNAPABLE MULTI-PACKAGE ARRAY SUBSTRATE, SNAPABLE MULTI-PACKAGE ARRAY AND SNAPABLE PACKAGED ELECTRONIC COMPONENTS
(75) Inventors: Gary L. Swiss; Thomas P. Glenn, both of Gilbert, AZ (US)
(73) Assignee: Amkor Technology, Inc., Chandler, AZ (US)
( * ) Notice: Subject to any disclaimer, the term of this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/539,314
(22) Filed: Mar. 30, 2000
(51) Int. CI.7 H01L 21/44
(52) U.S. CI 438/127; 438/113; 438/613
(58) Field of Search 438/106, 107,
438/109, 110, 111, 112, 113, 121, 124, 125, 126, 127, 612, 613; 257/697, 778, 678, 684, 707, 693, 729, 701
(56) References Cited
U.S. PATENT DOCUMENTS
4,236,296 A 12/1980 Woolhouse et al 29/569 L
4,237,601 A 12/1980 Woolhouse et al 29/583
4,961,821 A 10/1990 Drake et al 156/647
5,280,193 A * 1/1994 Lin et al 257/723
5,284,792 A 2/1994 Forster et al 437/129
5,362,681 A 11/1994 Roberts, Jr. et al 437/226
5,436,203 A * 7/1995 Lin 29/841
5,473,512 A * 12/1995 Degani et al 174/256
