(12) United States Patent ao) Patent No.: us 6,413,798 B2
Asada (45) Date of Patent: Jul. 2,2002
(54) PACKAGE HAVING VERY THIN
SEMICONDUCTOR CHIP, MULTICHIP
MODULE ASSEMBLED BY THE PACKAGE,
AND METHOD FOR MANUFACTURING
(75) Inventor: Junichi Asada, Kawasaki (JP)
(73) Assignee: Kabushiki Kaisha Toshiba, Kawasaki (JP)
( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 0 days.
(21) Appl. No.: 09/828,131
(22) Filed: Apr. 9, 2001
Related U.S. Application Data
(62) Division of application No. 09/484,032, filed on Jan. 18, 2000, now Pat. No. 6,239,496.
(30) Foreign Application Priority Data
Jan. 18, 1998 (JP) 11-9763
(51) Int. CI.7 H01L 21/44; H01L 21/48;
(52) U.S. CI 438/108; 438/106; 438/459
(58) Field of Search 438/106, 108,
(56) References Cited
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FOREIGN PATENT DOCUMENTS
JP 8-236694 9/1996
JP 11-145381 5/1999
* cited by examiner
Primary Examiner—David L. Talbott
Assistant Examiner—David Zarneke
(74) Attorney, Agent, or Firm—Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
A semiconductor package ol this invention has an insulating substrates, wiring layers disposed on the surface ol the insulating substrate, a semiconductor chip disposed in a device hole provided in the insulating substrate, inner-jointconductors for connecting at least part ol the bonding pads on the surface ol the semiconductor chip to the corresponding inner-joint-conductors and connection lands connected to the wiring layers. The device hole is provided so that it goes through the center ol the insulating substrate. The semiconductor chip is thinner than the insulating substrate. Then, this semiconductor chip is disposed in the device hole such that a bottom thereol is flush with a bottom plane ol the insulating substrate. Further, this invention provides a MCM in which plural pieces ol the thin semiconductor packages are laminated. In the MCM, the semiconductor packages are laminated such that top and bottom laces ol the thin silicon chip are inverted. Predetermined connection lands are electrically connected to each other through a connecting conductor. This MCM has a high mechanical strength in its stacked structure and there is a low possibility that crack may occur in the package due to stress in the bending direction.
6 Claims, 15 Drawing Sheets