Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the integrated circuit with an external circuit. The pad part is provided with a first junction consisting of a window...http://www.google.com.hk/patents/US6590297?utm_source=gb-gplus-share專利 US6590297 - Semiconductor chip having pads with plural junctions for different assembly methods
