A method for forming a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components is disclosed. The snapable multi-package substrate is formed with trenches that separate and define sections where individual packaged electronic components are fabricated...http://www.google.com.hk/patents/US6444499?utm_source=gb-gplus-share專利 US6444499 - Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
