Microelectronic imagers with prefabricated housings and methods of packaging microelectronic imagers are disclosed herein. In one embodiment, a microelectronic imager can include a microelectronic die, an image sensor, and an integrated circuit operatively coupled to the integrated circuit. The microelectronic...http://www.google.com.hk/patents/US20050275051?utm_source=gb-gplus-share專利 US20050275051 - Prefabricated housings for microelectronic imagers and methods for packaging microelectronic imagers
