An integrated circuit package in which three conductor columns for connecting an insulating substrate and an integrated circuit are connected in parallel for use as I/O vias. Thereby, the conductor columns in a multilayer wiring portion between an integrated circuit and an insulating substrate is prevented...http://www.google.com.hk/patents/US5468997?utm_source=gb-gplus-share專利 US5468997 - Integrated circuit package having a multilayered wiring portion formed on an insulating substrate
