The present invention relates to an interposer substrate for interconnecting between active electronic componentry such as but not limited to a single or multiple integrated circuit chips in either a single or a combination and elements that could comprise of a mounting substrate, substrate module, a...http://www.google.com.hk/patents/US20030206388?utm_source=gb-gplus-share專利 US20030206388 - Universial energy conditioning interposer with circuit architecture
