According to the present invention, a method of laminating at least two substrates together and circuitizing at least one surface of the laminate is provided. Pressure is exerted against opposite surfaces of each of said two substrates. An opening extends from a circuit-receiving surface of at least...http://www.google.com.hk/patents/US5578796?utm_source=gb-gplus-share專利 US5578796 - Apparatus for laminating and circuitizing substrates having openings therein
