An apparatus for bonding a particle material to near theoretical density, includes a chamber, a punch and die assembly for supporting a particle material, plungers for applying shear and/or axial pressures, and a power supply for applying a current. In the first stage, a pulsed current of about 1 to...http://www.google.com.hk/patents/US5989487?utm_source=gb-gplus-share專利 US5989487 - Apparatus for bonding a particle material to near theoretical density
