A multichip module that utilizes an angled interconnect to electrically interconnect chips in the module that are positioned at an angle relative to each other. The multichip module may comprise a first and second chips that are positioned in an orthogonal manner. The first and second chips are electrically...http://www.google.com.hk/patents/US6591492?utm_source=gb-gplus-share專利 US6591492 - Angled edge connections for multichip structures
