A method of making a multi-layer circuit assembly includes providing a core structure including an inner dielectric element having first and second metal layers on opposite surfaces thereof, forming one or more through vias extending through the metal layers and the inner dielectric element and coating...http://www.google.com.hk/patents/US7036222?utm_source=gb-gplus-share專利 US7036222 - Method for forming a multi-layer circuit assembly
