A method of making a stacked microelectronic assembly such as a semiconductor chip assembly and its resulting structure includes providing a flexible substrate having a plurality of attachment sites and conductive terminals and including a wiring layer with leads extending to the attachment sites. The...http://www.google.com.hk/patents/US6121676?utm_source=gb-gplus-share專利 US6121676 - Stacked microelectronic assembly and method therefor
