The present invention provides methods of fabricating integrated circuit devices that include a microelectronic substrate and a conductive layer disposed on the microelectronic substrate. An insulating layer is disposed on the conductive layer and the insulating layer includes an overhanging portion...http://www.google.com.hk/patents/US6953744?utm_source=gb-gplus-share專利 US6953744 - Methods of fabricating integrated circuit devices providing improved short prevention
