The invention provides improved packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. Methods of assembly are also provided. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a...http://www.google.com.hk/patents/US6906403?utm_source=gb-gplus-share專利 US6906403 - Sealed electronic device packages with transparent coverings
