Some embodiments of the present invention relate to a semiconducting device that includes an interposer having a fold which divides the interposer into a first section and a second section. A first die is attached to a first surface of the interposer at the first and second sections of the interposer....http://www.google.com.hk/patents/US7456048?utm_source=gb-gplus-share專利 US7456048 - Semiconducting device with folded interposer
