A method of fabricating micro-mechanical devices. A mesa is etched in a homogeneous wafer. The wafer is bonded to a patterned substrate with the mesa defining device elements suspended above the substrate. A portion of the wafer is removed until a desired device thickness is achieved. Discrete elements...http://www.google.com.hk/patents/US7300814?utm_source=gb-gplus-share專利 US7300814 - Method for fabricating micro-mechanical devices
