When a desired portion is separated from an integrated circuit chip or a semiconductor wafer, the portion is separated so that the resulting sample can be moved to a location for examination by TEM, SEM or other means. A sample portion of the chip or wafer containing an area of interest is separated...http://www.google.com.hk/patents/US20010045511?utm_source=gb-gplus-share專利 US20010045511 - Method for sample separation and lift-out
