Disclosed is a method for detecting electrical defects on test structures of a semiconductor die. The test structures includes a plurality of electrically-isolated test structures and a plurality of non-electrically-isolated test structures. The test structures each has a portion located partially within...http://www.google.com.hk/patents/US6771806?utm_source=gb-gplus-share專利 US6771806 - Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices
