A present invention includes a packaging technology that fabricates build-up layers on an encapsulated microelectronic die that has expanded area larger than that of the microelectronic die. An active surface of a microelectronic die is attached by an adhesive material to a protective film sheet to protect...http://www.google.com.hk/patents/US6489185?utm_source=gb-gplus-share專利 US6489185 - Protective film for the fabrication of direct build-up layers on an encapsulated die package
