A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a reference plane for the wiring in the...http://www.google.com.hk/patents/US8064222?utm_source=gb-gplus-share專利 US8064222 - Semiconductor integrated circuit device
