In an IC card and a manufacturing method therefor, an adhesive is applied between core layers in the vicinity of an opening in which an IC module is placed. The core sheet layers held between adhesive layers can easily be deformed when heat and pressure are applied. Therefore, a gap formed between the...http://www.google.com.hk/patents/US5250341?utm_source=gb-gplus-share專利 US5250341 - IC card
