The invention provides a method of testing a circuit on a substrate. Generally speaking, a substrate is located in a transfer chuck, a surface of a test chuck is moved into contact with a substrate, the substrate is secured to the test chuck, the test chuck is moved relative to the transfer chuck so...http://www.google.com.hk/patents/US7002337?utm_source=gb-gplus-share專利 US7002337 - Testing circuits on substrates