A TAB package is described which includes a flexible dielectric film with an outer edge, back and front faces and an aperture therein. The front face, as is conventional, is provided with a plurality of beam leads, which leads extend into the aperture and connect to a semiconductor chip. Thermally conductive...http://www.google.com.hk/patents/US4939570?utm_source=gb-gplus-share專利 US4939570 - High power, pluggable tape automated bonding package
