A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having...http://www.google.com.hk/patents/US7459797?utm_source=gb-gplus-share專利 US7459797 - Standoffs for centralizing internals in packaging process
