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Powertech Technology Inc.  

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August 2017 Powertech Technology Inc Corporate Sales Release �s�W�ܦ�ƾ�
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July 2017 Powertech Technology Inc Corporate Sales Release �s�W�ܦ�ƾ�
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Q2 2017 Powertech Technology Inc Earnings Release (Estimated) �s�W�ܦ�ƾ�
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June 2017 Powertech Technology Inc Corporate Sales Release �s�W�ܦ�ƾ�
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Powertech Technology Inc at UBS Taiwan Conference
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Powertech Technology Inc at Yuanta Asia Investment Conference
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May 2017 Powertech Technology Inc Corporate Sales Release
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Powertech Technology Inc Annual Shareholders Meeting
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Powertech Technology Inc at Jefferies & Fubon Taiwan Corporate Day
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Powertech Technology Inc at Macquarie Taiwan Corporate Day - NY
  

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CDP Score - D

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No.10 Datong Road, Hsinchu Industrial Park
HUKOU, 303
Taiwan
+886-3-5980300 (�q��)
+886-3-5979900 (�ǯu)

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Powertech Technology Inc. is a Taiwan-based company principally engaged in integrated circuits (ICs) packaging business. The Company operates its main business through the packaging of thin small-outline package (TSOP) ICs, quad flat no-lead (QFN) packaging, multi-chip package (MCP) packaging, stacked multi chip package (S-MCP) packaging, ball grid array (BGA) ICs packaging, package on package (POP) assembly services, as well as memory card packaging, among others. In addition, it is involved in the ICs testing services and wafer testing services. The Company operates its businesses primarily in Asia, Europe and the Americas.

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Duh Kung Tsai Chairman of the Board, Chief Executive Officer
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Evan Tseng Chief Financial Officer, Deputy General Manager, Director
Chia Yu Hung General Manager, Director
J.S. Leu Senior Deputy General Manager-Packaging Operation, Director
K.J. Chan Senior Deputy General Manager-Testing Operation
John Chang Senior Deputy General Manager-Information & Materials Management
Y.C. Chen Deputy General Manager-Packaging Manufacturing
Y.C. Chi Deputy General Manager-Memory Testing Operation
David Fang Deputy General Manager-Packaging Research & Development
Peter Lai Senior Deputy General Manager-Business Sales