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Kinsus Interconnect Technology Corp.  

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80.90
+0.20 (0.25%)
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�`���� 360.81��
���ղv 16.30
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�C�ѬէQ 4.96
�ѥ� 4.45��
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2017�~1��30��
Q4 2016 Kinsus Interconnect Technology Corp Earnings Release (Estimated)
2017�~1��4��
December 2016 Kinsus Interconnect Technology Corp Corporate Sales Release (Estimated)
  

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�b�Q��v 7.65% 8.95%
��~�Q��v 9.78% 11.09%
��税���«e�Q�� - 26.27%
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�����ѥ��^���v 6.80% 7.80%
���u 7,207 -
CDP Score - -

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No.1245, Junghua Road, Shihlei Village
TAOYUAN, 327
Taiwan
+886-3-4871919 (�q��)
+886-3-4871920 (�ǯu)

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Kinsus Interconnect Technology Corp. is a Taiwan-based company principally engaged in the manufacture and distribution of ball grid array (BGA) substrates. The Company��s products portfolio consists of plastic BGA substrates, multi-chip-module (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and flip chip CSP substrates, as well as chip on flex (COF), among others. Its products are applied in the manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others. The Company distributes its products in domestic market and to overseas markets.

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Ming Dong Kuo Chairman of the Board, Chief Executive Officer
Jane Lu Deputy Chief Executive Officer, Director
Jeff Chang Chief Technology Officer
Scott Chen General Manager
Edward Huang Deputy General Manager
Kevin Huang Deputy General Manager-Manufacturing
Eddie Lin Deputy General Manager
T.S. Yang Senior Deputy General Manager
Suzhen Liu Head of Finance and Accounting
Zhong Ren Cheng Director